By Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
This e-book explains for readers how 3D chip stacks promise to extend the extent of on-chip integration, and to layout new heterogeneous semiconductor units that mix chips of other integration applied sciences (incl. sensors) in one package deal of the smallest attainable measurement. The authors specialize in heterogeneous 3D integration, addressing the most very important demanding situations during this rising expertise, together with contactless, optics-based, and carbon-nanotube-based 3D integration, in addition to signal-integrity and thermal administration concerns in copper-based 3D integration. insurance additionally contains the 3D heterogeneous integration of energy resources, photonic units, and non-volatile stories in response to new fabrics systems.
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Extra info for 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
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Electrochem. Soc. 153(1), C37–C50 (2006) 27. P. I. Suni, Impedance studies of Ru oxide reduction in sulfuric acid. J. Electrochem. Soc. 158(2), H111–H114 (2011) 28. Ch. Wenzel, K. Drescher, Applikation flip-chip-bumping, in Interdisziplinäre Methoden in der Aufbau- und Verbindungstechnik, ed. -J. Wolter, S. Wiese (Ddp Goldenbogen, Dresden, Germany, 2003), pp. 157–170. 1 Introduction Two developments in microelectronic systems can be observed over the last decades. The first development is that the complexity for minimum component cost in the digital domain increases at an exponential rate (Moore’s Law), resulting in highly integrated system-on-chip (SoC).